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Beschreibung
The performance of the deep sub-micron technology CMOS integrated circuits is limited by the wired chip-to-chip and on-chip interconnects. This work proposes two technologies for widening up this bottleneck. For the on-chip buses we propose the introduction of spatial and temporal coding techniques, which provide substantial increase of the data rate at the price of a simple coding hardware. The chip-to-chip interconnects can be implemented using wireless data transmission. The area-efficient on-chip antenna integration and the achievable chip-to-chip channel capacities are presented.
Details
| Verlag | Südwestdeutscher Verlag für Hochschulschriften |
| Ersterscheinung | 13. Juli 2011 |
| Maße | 22 cm x 15 cm x 0.8 cm |
| Gewicht | 197 Gramm |
| Format | Softcover |
| ISBN-13 | 9783838126494 |
| Seiten | 120 |
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