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Softcover - 9783642059155
374,49 €
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Beschreibung
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Applications and Technology
Applications and Technology
Details
| Verlag | Springer Berlin |
| Ersterscheinung | 14. Mai 2004 |
| Maße | 23.5 cm x 15.5 cm |
| Gewicht | 1035 Gramm |
| Format | Hardcover |
| ISBN-13 | 9783540210498 |
| Seiten | 504 |
Schlagwörter
Characterization and Analytical Technique, Condensed Matter Physics, Electrical and Electronic Engineering, Elektrotechnik, Materialwissenschaft, Optical Materials, Physik der kondensierten Materie (Flüssigkeits- und Festkörperphysik), Surfaces - Interfaces and Thin Film, Technische Anwendung von elektronischen - magnetischen - optischen Materialien, Werkstoffprüfung
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