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Three-Dimensional Integration of Semiconductors

Hardcover - 9783319186740
106,99 €
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Softcover - 9783319792552
160,49 €

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Weitere Formate

Softcover - 9783319792552
160,49 €

Beschreibung

This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.

Processing, Materials, and Applications

Processing, Materials, and Applications

Details

Verlag Springer International Publishing
Ersterscheinung 16. Dezember 2015
Maße 23.5 cm x 15.5 cm
Gewicht 805 Gramm
Format Hardcover
ISBN-13 9783319186740
Auflage 1st ed. 2015
Seiten 408