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Beschreibung
This book describes techniques that can reduce mechanical-stress-induced inaccuracy and long-term instability in chips. The authors also show that the piezojunction effect can be applied for new types of mechanical-sensor structures. Thermo-mechanical stress is induced when packaged chips cool down to the temperature of application.
Details
| Verlag | Springer US |
| Ersterscheinung | 09. Dezember 2010 |
| Maße | 23.5 cm x 15.5 cm |
| Gewicht | 454 Gramm |
| Format | Softcover |
| ISBN-13 | 9781441952820 |
| Auflage | Softcover reprint of the original 1st ed. 2002 |
| Seiten | 162 |
Schlagwörter
Circuits and Systems, Electrical and Electronic Engineering, Electrical Engineering, Electronic Circuits and Systems, Elektrotechnik, Optical and Electronic Materials, Optical Materials, Schaltkreise und Komponenten (Bauteile), Technische Anwendung von elektronischen - magnetischen - optischen Materialien
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