✍️ 🧑‍🦱 💚 Autor:innen verdienen bei uns doppelt. Dank euch haben sie so schon 411.512 € mehr verdient. → Mehr erfahren 💪 📚 🙏

Technology CAD Systems

Technology CAD Systems

Softcover - 9783709193174
53,49 €
  • Versandkostenfrei
Auf meine Merkliste
  • Hinweis: Print on Demand. Lieferbar in 2 Tagen.
  • Lieferzeit nach Versand: ca. 1-2 Tage
  • inkl. MwSt. & Versandkosten (innerhalb Deutschlands)

Autorenfreundlich Bücher kaufen?!

Beschreibung

As the cost of developing new semiconductor technology at ever higher bit/gate densities continues to grow, the value of using accurate TCAD simu lation tools for design and development becomes more and more of a necessity to compete in today's business. The ability to tradeoff wafer starts in an advanced piloting facility for simulation analysis and optimization utilizing a "virtual fab" S/W tool set is a clear economical asset for any semiconductor development company. Consequently, development of more sophisticated, accurate, physics-based, and easy-to-use device and process modeling tools will receive continuing attention over the coming years. The cost of maintaining and paying for one's own internal modeling tool development effort, however, has caused many semiconductor development companies to consider replacing some or all of their internal tool development effort with the purchase of vendor modeling tools. While some (noteably larger) companies have insisted on maintaining their own internal modeling tool development organization, others have elected to depend totally on the tools offered by the TCAD vendors and have consequently reduced their mod eling staffs to a bare minimal support function. Others are seeking to combine the best of their internally developed tool suite with "robust", "proven" tools provided by the vendors, hoping to achieve a certain synergy as well as savings through this approach. In the following sections we describe IBM's internally developed suite of TCAD modeling tools and show several applications of the use of these tools.

Details

Verlag Springer Wien
Ersterscheinung 25. Januar 2012
Maße 24.4 cm x 17 cm
Gewicht 562 Gramm
Format Softcover
ISBN-13 9783709193174
Auflage Softcover reprint of the original 1st edition 1993
Seiten 309

Herstellerinformationen +