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Beschreibung
The 35 full papers and 12 short papers included in this book were carefully reviewed and selected from 193 submissions. The TAAI 2023 provides a platform for experts and scholars from domestic and international universities, research units, and industries to exchange AI technologies and application results.
28th International Conference, TAAI 2023, Yunlin, Taiwan, December 1–2, 2023, Proceedings, Part II
Details
| Verlag | Springer Singapore |
| Ersterscheinung | 28. März 2024 |
| Maße | 23.5 cm x 15.5 cm |
| Gewicht | 406 Gramm |
| Format | Softcover |
| ISBN-13 | 9789819717132 |
| Seiten | 241 |