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Softcover - 9783709174159
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Beschreibung
This volume contains the proceedings of the 1998 International Conference on Simulation of Semiconductor Processes and Devices and provides an open forum for the presentation of the latest results and trends in modeling and simulation of semiconductor equipment, processes and devices.
Topics include:
• semiconductor equipment simulation
• process modeling and simulation
• device modeling and simulation of complex structures
• interconnect modeling
• integrated systems for process, device, circuit simulation and optimisation
• numerical methods and algorithms
• compact modeling and parameter extraction
• modeling for RF applications
• simulation and modeling of new devices (heterojunction based, SET’s, quantum effect devices, laser based ...)
SISPAD 98
SISPAD 98
Details
| Verlag | Springer Wien |
| Ersterscheinung | 17. August 1998 |
| Maße | 24.4 cm x 17 cm |
| Gewicht | 890 Gramm |
| Format | Hardcover |
| ISBN-13 | 9783211832080 |
| Auflage | 1998 |
| Seiten | 410 |
Schlagwörter
Applied Dynamical Systems, Computer Modelling, Computermodellierung und -simulation, Electronic Circuits and Systems, Electronics and Microelectronics - Instrumentation, Elektronik, Kybernetik und Systemtheorie, Mathematik für Ingenieure, Optical Materials, Schaltkreise und Komponenten (Bauteile), Technische Anwendung von elektronischen - magnetischen - optischen Materialien
Bekannt durch
