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Beschreibung
The book presents the basic steps and the technical implementation of individual processes for microelectronic circuit integration in silicon. Interaction and influences of e. g. oxidation, etching, doping and thermal processes for integrating CMOS- and Bipolar circuits are discussed in detail, beginning with the purification of silicon up to the encapsulated integrated circuit. It includes modern processes like atomic layer deposition and etching for nanoscale structures and compares improvements like silicide contacts, copper metallization, high-k dielectrics, and SOI and FINFET structures. All processes are presented looking from the process engineer’s view.
Processing and Integration of Microelectronic Devices
Details
| Verlag | Springer Fachmedien Wiesbaden GmbH |
| Ersterscheinung | 03. August 2023 |
| Maße | 24 cm x 16.8 cm |
| Gewicht | 524 Gramm |
| Format | Softcover |
| ISBN-13 | 9783658410407 |
| Auflage | 1st edition 2023 |
| Seiten | 264 |
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