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Signal Processing, Telecommunication & Embedded Systems: AI and ML Applications

Signal Processing, Telecommunication & Embedded Systems: AI and ML Applications

Hardcover - 9783032203175
320,99 €
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Beschreibung

This book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics, and telecommunication. It contains original research works presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2025), held in London, during October 2025. The book is divided into four volumes, and it covers papers written by scientists, research scholars, and practitioners from leading universities, engineering colleges, and R&D institutes from all over the world and shares the latest breakthroughs in and promising solutions to the most important issues facing today’s society.

Proceedings of Tenth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2025), Volume 3

Details

Verlag Springer International Publishing
Ersterscheinung 27. März 2026
Maße 23.5 cm x 15.5 cm
Gewicht 1037 Gramm
Format Hardcover
ISBN-13 9783032203175
Seiten 567

Schlagwörter

Computernetzwerke und maschinelle Kommunikation, Cyber-Physical Systems, Electronic Circuits and Systems, Electronics and Microelectronics - Instrumentation, Elektronik, Internet of Things, Kybernetik und Systemtheorie, Schaltkreise und Komponenten (Bauteile)

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