✍️ 🧑‍🦱 💚 Autor:innen verdienen bei uns doppelt. Dank euch haben sie so schon 418.243 € mehr verdient. → Mehr erfahren 💪 📚 🙏

Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology

von Weimin Wang und Yongle Wu
Softcover - 9789819914579
149,79 €
  • Versandkostenfrei
Auf meine Merkliste
  • Hinweis: Print on Demand. Lieferbar in 2 Tagen.
  • Lieferzeit nach Versand: ca. 1-2 Tage
  • inkl. MwSt. & Versandkosten (innerhalb Deutschlands)

Weitere Formate

Hardcover - 9789819914548
149,79 €

Autorenfreundlich Bücher kaufen?!

Weitere Formate

Hardcover - 9789819914548
149,79 €

Beschreibung

This book adopts the latest academic achievements of microwave and millimeter-wave chips based on thin-film integrated passive device technology as specific cases. Coherent processes of basic theories and design implementations of microwave and millimeter-wave chips are presented in detail. It forms a complete system from design theory, circuit simulation, full-wave electromagnetic simulation, and fabrication to measurement. Five representative microwave and millimeter-wave passive chips based on TFIPD technology are taken as examples to demonstrate the complete process from theory, design, simulation, fabrication, and measurement, which is comprehensive, systematical, and easy to learn and understand, convenient to operate, and close to the practical application. 

This book is mainly aimed at the design and simulation of microwave and millimeter-wave chips based on thin-film integrated passive device technology. On the basis of specific cases, it introduces the whole process from theory, design, simulation, optimization, fabrication to measurement of the balanced filter, microstrip filter, absorptive filter, power divider, and balun. 

This book is suitable for the professional technicians who are engaged in the design and engineering application of microwave and millimeter-wave device chips. It can also be used as the textbook of electronic science and technology, electromagnetic field and microwave technology, electronic engineering, radar engineering, integrated circuit, and other related majors in colleges and universities.



 


Design and Simulation

Design and Simulation

Details

Verlag Springer Singapore
Ersterscheinung 03. Juni 2024
Maße 23.5 cm x 15.5 cm
Gewicht 499 Gramm
Format Softcover
ISBN-13 9789819914579
Seiten 311

Herstellerinformationen +