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Micro-Electronics and Telecommunication Engineering

Micro-Electronics and Telecommunication Engineering

Softcover - 9789811687204
246,09 €
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Beschreibung

The book presents high-quality papers from the Fourth International Conference on Microelectronics and Telecommunication Engineering (ICMETE 2021). It discusses the latest technological trends and advances in major research areas such as microelectronics, wireless communications, optical communication, signal processing, image processing, big data, cloud computing, artificial intelligence and sensor network applications. This book includes the contributions of national and international scientists, researchers, and engineers from both academia and the industry. The contents of this volume will be useful to researchers, professionals, and students alike.

Proceedings of 5th ICMETE 2021

Details

Verlag Springer Singapore
Ersterscheinung 01. März 2022
Maße 23.5 cm x 15.5 cm
Gewicht 1276 Gramm
Format Softcover
ISBN-13 9789811687204
Auflage 1st ed. 2022
Seiten 829

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