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Softcover - 9783030226008
106,99 €
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Beschreibung
This book focuses on the mechanical properties of silicides for very large scale integration (VLSI) applications. It presents the fabrication process for bulk silicides and thin films, and list complete testing deformation for a variety of silicon based compounds. The author also presents dislocation in silicides, fatigue and fracture aspects. A special chapter is given on deformation in silicides in the nano scale. Composites and alloys are also considered.
Details
| Verlag | Springer International Publishing |
| Ersterscheinung | 30. Juli 2019 |
| Maße | 23.5 cm x 15.5 cm |
| Gewicht | 554 Gramm |
| Format | Hardcover |
| ISBN-13 | 9783030225971 |
| Seiten | 274 |
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