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Beschreibung
MCM-C/Mixed Technologies and Thick Film Sensors highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks, high performance-low temperature dielectric tapes, precision via generation by both laser and mechanical methods, and enhanced screen printing technologies have given us feature resolution to the 50 mum line/space level. Thermal management has greatly benefitted from such new materials as cofire AIN and diamond.
MCM-C technology is compatible with thick film sensors, and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area.
Details
Verlag | Springer Netherland |
Ersterscheinung | November 2012 |
Maße | 24 cm x 16 cm |
Gewicht | 532 Gramm |
Format | Softcover |
ISBN-13 | 9789401040396 |
Auflage | Softcover reprint of the original 1st ed. 1995 |
Seiten | 318 |