Liquid Cooling Cold Plate System for Power Modules

The analytical modeling for thermal and pressure drop analysis of a liquid cooling cold plate system has been illustrated in this book. For this, a design problem is stated and solved as a case study. For validation, results are compared with the solution obtained from computational fluid dynamics (CFD) analysis using ANSYS IcePak. Workout includes, selection of materials and physical layout with appropriate justifications, analytical thermal modeling for heat transfer between single chip and coolant and its modification for various channel layouts, devising a procedure for determining minimum mass flow rate for meeting constraint of maximum junction temperature and analytical modeling for pressure drop analysis in different channel layouts. Both the analytical thermal and pressure drop models were coded in EES software (codes included).