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Softcover - 9783031861048
53,49 €
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Beschreibung
This book offers a comprehensive introduction and in-depth information on all the packaging technologies and fabrication methodologies employed in advanced semiconductor packaging. Coverage includes materials, substrates, and assembly processes, as well as critical areas of testing and reliability, which are crucial for ensuring the utmost quality and reliability of advanced packaging solutions.
Details
| Verlag | Springer International Publishing |
| Ersterscheinung | 23. April 2025 |
| Maße | 24 cm x 16.8 cm |
| Gewicht | 525 Gramm |
| Format | Hardcover |
| ISBN-13 | 9783031861017 |
| Seiten | 183 |
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