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Beschreibung
Ink-jet printed devices on the flexible substrate are inexpensive and large area compatible as compared to rigid substrates. However, during fabrication and service they are subjected to complex strains, resulting in crack formation or delamination within the layers, affecting the device performance. Therefore, it is necessary to understand their failure mechanisms by correlating their electrical or structural properties with applied strain, supported by detailed microstructural investigations.
Details
| Verlag | KIT Scientific Publishing |
| Ersterscheinung | 15. Februar 2019 |
| Maße | 21 cm x 14.8 cm |
| Gewicht | 310 Gramm |
| Format | Softcover |
| ISBN-13 | 9783731508533 |
| Seiten | 158 |
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