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Beschreibung
Photonic integrated circuits (PIC) become increasingly important for numerous applications. Mass production of PIC has become widely available, but large-volume low-cost photonic packaging still represents a challenge. Additive micro-fabrication of free-form optical coupling structures is discussed as a concept to overcome this technology gap. Multi-photon 3D-lithography is used to fabricate dielectric waveguides ("photonic wire bonds", PWB) as well as facet-attached microlenses (FaML).
Details
| Verlag | KIT Scientific Publishing |
| Ersterscheinung | 24. April 2023 |
| Maße | 21 cm x 14.8 cm |
| Gewicht | 620 Gramm |
| Format | Softcover |
| ISBN-13 | 9783731512738 |
| Auflage | 1. Auflage |
| Seiten | 292 |
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