Heat Transfer Enhancement by Using Micro-Channel

There have been few studies on a three-dimensional noncircular microchannel carried out to look into the effect of different shapes on the heat transfer and fluid flow. 25 years ago, many researchers have been able to illustrate that high heat fluxes could be dissipated by a fluid flowing through microchannels that offer an increased surface area to volume ratio. Microchannels can be formed in a straightforward manner on the chip integrated circuit substrate. The strength of the location on the substrate is evident in the reduced thermal resistance from the heat source to the heat sink. To avoid any interruption to the circuit function, the microchannels can be built onto the electrically inactive side of the chip, and the dimensional double pipe heat exchanger has been carried out to investigate the effect of louvered strips inserts on the heat transfer rate, skin friction coefficient and the performance evaluation criteria (PEC).The expansion of manufacturing of small devises demanded a better understanding of fluid flow and heat transfer in microgeometries.