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Beschreibung
This book describes the various tradeoffs systems designers face when designing embedded memory. Readers designing multi-core systems and systems on chip will benefit from the discussion of different topics from memory architecture, array organization, circuit design techniques and design for test. The presentation enables a multi-disciplinary approach to chip design, which bridges the gap between the architecture level and circuit level, in order to address yield, reliability and power-related issues for embedded memory.
Details
| Verlag | Springer US |
| Ersterscheinung | 23. Oktober 2013 |
| Maße | 23.5 cm x 15.5 cm |
| Gewicht | 342 Gramm |
| Format | Hardcover |
| ISBN-13 | 9781461488804 |
| Auflage | 2014 |
| Seiten | 95 |
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