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Beschreibung
Part I, The Building Blocks, discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires (including power analysis, temperature-dependent device modeling, thermal/electrothermal simulation, and experimental setup-calibration).
Part II, The Applications, discusses three important applications of VLSI electrothermal analysis including temperature-dependent electromigration diagnosis, cell-level thermal placement and temperature-driven power and timing analysis.
Electrothermal Analysis of VLSI Systems will be useful for researchers in the fields of IC reliability analysis and physical design, as well as VLSI designers and graduate students.
Details
| Verlag | Springer US |
| Ersterscheinung | 20. April 2013 |
| Maße | 23.5 cm x 15.5 cm |
| Gewicht | 371 Gramm |
| Format | Softcover |
| ISBN-13 | 9781475773736 |
| Auflage | 2002 |
| Seiten | 210 |