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Beschreibung
This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD).
The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.
Details
| Verlag | Springer International Publishing |
| Ersterscheinung | 22. Juli 2025 |
| Maße | 23.5 cm x 15.5 cm |
| Gewicht | 463 Gramm |
| Format | Hardcover |
| ISBN-13 | 9783031947940 |
| Seiten | 178 |
Schlagwörter
Chemie, Electronic Circuits and Systems, Electronic Materials, Electronics Design and Verification, Fertigungstechnik und Ingenieurwesen, Industrial and Production Engineering, Materials Engineering, Materialwissenschaft, Schaltkreise und Komponenten (Bauteile), Technische Anwendung von elektronischen - magnetischen - optischen Materialien
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