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Beschreibung
IFIP 20th World Computer Congress, TC10 Working Conference on Distributed and Parallel Embedded Systems (DIPES 2008), September 7-10, 2008, Milano, Italy
Details
| Verlag | Springer US |
| Ersterscheinung | 19. November 2010 |
| Maße | 23.5 cm x 15.5 cm |
| Gewicht | 376 Gramm |
| Format | Softcover |
| ISBN-13 | 9781441935052 |
| Auflage | Softcover reprint of hardcover 1st ed. 2008 |
| Seiten | 226 |