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Beschreibung
The 106 full papers and 36 short papers presented were thoroughly reviewed and selected from the 305 submissions. They focus on a wide range of computer science topics, especially AI, data science, and engineering, and technology-based education, by addressing frontier technical and business issues essential to the applications of data science in both higher education and advancing e-Society.
18th International Conference, ICCSE 2023, Sepang, Malaysia, December 1–7, 2023, Proceedings, Part II
Details
| Verlag | Springer Singapore |
| Ersterscheinung | 26. Februar 2024 |
| Maße | 23.5 cm x 15.5 cm |
| Gewicht | 598 Gramm |
| Format | Softcover |
| ISBN-13 | 9789819707904 |
| Seiten | 377 |