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Hardcover - 9783319297446
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Beschreibung
This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.
Process, Design and Applications
Process, Design and Applications
Details
| Verlag | Springer International Publishing |
| Ersterscheinung | 30. Mai 2018 |
| Maße | 23.5 cm x 15.5 cm |
| Gewicht | 528 Gramm |
| Format | Softcover |
| ISBN-13 | 9783319806426 |
| Auflage | Softcover reprint of the original 1st ed. 2017 |
| Seiten | 333 |
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