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Hardcover - 9783319204802
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Beschreibung
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.
From Emerging Processes to Heterogeneous Systems
From Emerging Processes to Heterogeneous Systems
Details
| Verlag | Springer International Publishing |
| Ersterscheinung | 26. Mai 2018 |
| Maße | 23.5 cm x 15.5 cm |
| Gewicht | 552 Gramm |
| Format | Softcover |
| ISBN-13 | 9783319793054 |
| Auflage | Softcover reprint of the original 1st ed. 2016 |
| Seiten | 339 |
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