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Beschreibung
This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.
Details
| Verlag | Springer US |
| Ersterscheinung | 27. Dezember 2012 |
| Maße | 23.5 cm x 15.5 cm |
| Gewicht | 441 Gramm |
| Format | Softcover |
| ISBN-13 | 9781461427483 |
| Seiten | 278 |
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