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Hardcover - 9783319547138
106,99 €
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Beschreibung
This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.
Details
| Verlag | Springer International Publishing |
| Ersterscheinung | 09. Mai 2018 |
| Maße | 23.5 cm x 15.5 cm |
| Gewicht | 306 Gramm |
| Format | Softcover |
| ISBN-13 | 9783319854618 |
| Auflage | Softcover reprint of the original 1st ed. 2017 |
| Seiten | 182 |
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