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Supply Chain Localization in the Semiconductor Industry

von Tin-Chih Toly Chen
Hardcover - 9783031812798
149,79 €
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Weitere Formate

Softcover - 9783031812828
149,79 €

Autorenfreundlich Bücher kaufen?!

Weitere Formate

Softcover - 9783031812828
149,79 €

Beschreibung

This book provides a comprehensive exploration of semiconductor supply chain localization, offering insights into the formulation of effective strategies and ways to enhance the competitiveness and sustainability of semiconductor manufacturers through supply chain localization.

The semiconductor industry is currently witnessing a significant localization wave, with a growing trend of wafer foundries relocating their production capacity closer to chip designers. This shift is primarily driven by factors such as the US-China trade war, geopolitical considerations, the impact of Covid-19, the Russia-Ukraine conflict, and the increasing importance of environmental awareness. By localizing semiconductor supply chains, companies can effectively address these challenges while also improving their competitive edge and ensuring long-term sustainability in the face of political and war risks.

However, achieving supply chain localization in the semiconductor industry is a complex endeavor, as traditional factors considered in semiconductor supply chain management may no longer be decisive. Moreover, existing research on the subject is often scattered across various journal issues and conference proceedings, necessitating a systematic integration of these findings. Furthermore, most of the available supply chain management-related books do not specifically focus on this topic. This book aims to bridge these gaps by providing a comprehensive resource that combines relevant references, real-world cases, and supporting evidence.

 

Rebuilding the Competitiveness and Sustainability of Semiconductor Manufacturers

Rebuilding the Competitiveness and Sustainability of Semiconductor Manufacturers

Details

Verlag Springer International Publishing
Ersterscheinung 17. Januar 2025
Maße 23.5 cm x 15.5 cm
Gewicht 453 Gramm
Format Hardcover
ISBN-13 9783031812798
Seiten 160

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