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Signal Processing, Telecommunication and Embedded Systems with AI and ML Applications

Hardcover - 9789819784219
267,49 €
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Weitere Formate

Softcover - 9789819784240
267,49 €

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Weitere Formate

Softcover - 9789819784240
267,49 €

Beschreibung

The book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics, and telecommunication. It contains original research works presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2023), organized by Department of Electronics and Communication Engineering, National Institute of Technology Mizoram, India during 6 – 7 October 2023. The book is divided into two volumes, and it covers papers written by scientists, research scholars and practitioners from leading universities, engineering colleges and R&D institutes from all over the world and share the latest breakthroughs in and promising solutions to the most important issues facing today’s society.

Proceedings of 8th International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2023)

Proceedings of 8th International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2023)

Details

Verlag Springer Singapore
Ersterscheinung 11. Dezember 2024
Maße 23.5 cm x 15.5 cm
Gewicht 1065 Gramm
Format Hardcover
ISBN-13 9789819784219
Seiten 523

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