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Beschreibung
This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.
Details
| Verlag | Springer International Publishing |
| Ersterscheinung | 09. Juni 2018 |
| Maße | 23.5 cm x 15.5 cm |
| Gewicht | 295 Gramm |
| Format | Softcover |
| ISBN-13 | 9783319847191 |
| Auflage | Softcover reprint of the original 1st ed. 2017 |
| Seiten | 172 |
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