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Beschreibung
This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.
Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of "high-quality development" a focus on reliability is essential to advancing manufacturing.
Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry.
Details
| Verlag | Springer Singapore |
| Ersterscheinung | 14. April 2026 |
| Maße | 23.5 cm x 15.5 cm |
| Format | Hardcover |
| ISBN-13 | 9789819538843 |
| Seiten | 510 |
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