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Micro-Electronics and Telecommunication Engineering

Micro-Electronics and Telecommunication Engineering

Softcover - 9789819995615
267,49 €
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Beschreibung

The book presents high-quality papers from the Seventh International Conference on Microelectronics and Telecommunication Engineering (ICMETE 2023). It discusses the latest technological trends and advances in major research areas such as microelectronics, wireless communications, optical communication, signal processing, image processing, Big Data, cloud computing, artificial intelligence, and sensor network applications. This book includes the contributions of national/international scientists, researchers, and engineers from both academia and the industry. The contents of this book will be useful to researchers, professionals, and students alike.

Proceedings of 7th ICMETE 2023

Details

Verlag Springer Singapore
Ersterscheinung 22. März 2024
Maße 23.5 cm x 15.5 cm
Gewicht 1406 Gramm
Format Softcover
ISBN-13 9789819995615
Seiten 815

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