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Beschreibung
This work presents a low temperature co-fired ceramic (LTCC) technology based system-in-package (SiP) operating beyond 100 GHz. The SiP encloses a semiconductor transceiver chip in a pea-sized LTCC package. The SiP is efficient and robust in terms of its electrical, thermal and mechanical characteristics. Moreover, it is low-cost and requires only standard manufacturing and assembly techniques. Finally, two fully-integrated 122 GHz radar sensors are demonstrated in LTCC technology.
Details
| Verlag | KIT Scientific Publishing |
| Ersterscheinung | 17. Oktober 2019 |
| Maße | 21 cm x 14.8 cm |
| Gewicht | 485 Gramm |
| Format | Softcover |
| ISBN-13 | 9783731509455 |
| Seiten | 254 |
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