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Beschreibung
This book explores the technological advancements in semiconductors through several key aspects: transistor, interconnect, lithography, packaging, and memory. By blending together the history and technological progress with interesting stories, and avoiding complex physics or formulas, the book aims to spark the interest of a diverse group of readers, encouraging them to enter this exciting industry. Additionally, it seeks to broaden the horizons of engineers who are currently focused on narrow areas of the field, offering them a more comprehensive perspective on the industry's vast scope and potential.
Transistor, Interconnect, Packaging, Lithography and Memory
Details
| Verlag | Springer International Publishing |
| Ersterscheinung | 03. Januar 2026 |
| Maße | 24 cm x 16.8 cm |
| Gewicht | 610 Gramm |
| Format | Hardcover |
| ISBN-13 | 9783032039996 |
| Seiten | 216 |
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