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Beschreibung
This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author’s extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level.
Details
| Verlag | Springer International Publishing |
| Ersterscheinung | Dezember 2018 |
| Maße | 23.5 cm x 15.5 cm |
| Gewicht | 295 Gramm |
| Format | Softcover |
| ISBN-13 | 9783030093235 |
| Auflage | Softcover reprint of the original 1st ed. 2018 |
| Seiten | 177 |
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