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Softcover - 9789811685569
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Beschreibung
This book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics and telecommunication. It contains original research works presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2021), held in Bhubaneswar, Odisha, India during 27–28 August, 2021. The papers were written by scientists, research scholars and practitioners from leading universities, engineering colleges and R&D institutes from all over the world and share the latest breakthroughs in and promising solutions to the most important issues facing today’s society.
Proceedings of Sixth International Conference on Microelectronics, Electromagnetics and Telecommunications (ICMEET 2021), Volume 2
Proceedings of Sixth International Conference on Microelectronics, Electromagnetics and Telecommunications (ICMEET 2021), Volume 2
Details
| Verlag | Springer Singapore |
| Ersterscheinung | 24. März 2022 |
| Maße | 23.5 cm x 15.5 cm |
| Gewicht | 992 Gramm |
| Format | Hardcover |
| ISBN-13 | 9789811685538 |
| Seiten | 537 |
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