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Hardcover - 9789401790376
106,99 €
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Beschreibung
Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.
Details
| Verlag | Springer Netherland |
| Ersterscheinung | 27. September 2016 |
| Maße | 23.5 cm x 15.5 cm |
| Gewicht | 446 Gramm |
| Format | Softcover |
| ISBN-13 | 9789401779494 |
| Auflage | Softcover reprint of the original 1st ed. 2014 |
| Seiten | 280 |
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