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Beschreibung
This symposium is organized by the University of Castilla-La Mancha, the Osaka Institute of Technology and the University of Salamanca. The present edition was held in Toledo, Spain, from 20 th – 22 nd June, 2018.
Details
| Verlag | Springer International Publishing |
| Ersterscheinung | 05. Juli 2018 |
| Maße | 23.5 cm x 15.5 cm |
| Gewicht | 587 Gramm |
| Format | Softcover |
| ISBN-13 | 9783319946481 |
| Seiten | 369 |