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Softcover - 9783319345345
109,99 €
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Beschreibung
This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable.
Details
| Verlag | Springer International Publishing |
| Ersterscheinung | 02. Dezember 2013 |
| Maße | 23.5 cm x 15.5 cm |
| Gewicht | 565 Gramm |
| Format | Hardcover |
| ISBN-13 | 9783319023779 |
| Auflage | 2014 |
| Seiten | 245 |
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