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Beschreibung
3D integration has risen a great deal of interest in both the industrial and academic worlds. It is considered a key technology capable of increasing chip performance in the coming years. This book describes the issues introduced by this emerging technology and motivates the need for new design automation tools. It also presents and analyzes extensively the methods developed by the author that address thermal issues in early stages of the design of 3D Multiprocessors Systems-on-Chip (MPSoC).
Details
| Verlag | LAP LAMBERT Academic Publishing |
| Ersterscheinung | 30. Oktober 2014 |
| Maße | 22 cm x 15 cm x 1.1 cm |
| Gewicht | 262 Gramm |
| Format | Softcover |
| ISBN-13 | 9783659612510 |
| Seiten | 164 |
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