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Benefiting from Thermal and Mechanical Simulation in Micro-Electronics

Hardcover - 9780792372783
106,99 €
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Softcover - 9781441948731
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Weitere Formate

Softcover - 9781441948731
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Beschreibung

Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development. Main areas covered are:- The impact of simulation on industry profitability Approaches to simulation The state-of-the-art methodologies of simulation Design optimization by simulation £/LIST£ Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics.

Details

Verlag Springer US
Ersterscheinung Dezember 2000
Maße 23.5 cm x 15.5 cm
Gewicht 483 Gramm
Format Hardcover
ISBN-13 9780792372783
Auflage 2000
Seiten 192