{"product_id":"wafer-bonding-applications-and-technology-von-marin-alexe-ulrich-gosele-hrsg","title":"Wafer Bonding","description":"During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.\u003cdiv class=\"aw-variant-hidden-subtitle-div\" id=\"aw-variant-subtitle-9783540210498\"\u003e\u003ch3\u003eApplications and Technology\u003c\/h3\u003e\u003c\/div\u003e\u003cdiv class=\"aw-variant-hidden-subtitle-div\" id=\"aw-variant-subtitle-9783642059155\"\u003e\u003ch3\u003eApplications and Technology\u003c\/h3\u003e\u003c\/div\u003e","brand":"Libri","offers":[{"title":"Hardcover - 9783540210498","offer_id":50710936070,"sku":"9783540210498","price":374.49,"currency_code":"EUR","in_stock":true},{"title":"Softcover - 9783642059155","offer_id":39436728631389,"sku":"9783642059155","price":374.49,"currency_code":"EUR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0940\/0622\/files\/d36b2bd8-6b84-4eae-89cb-93942cb3c549.jpg?v=1778133966","url":"https:\/\/shop.autorenwelt.de\/products\/wafer-bonding-applications-and-technology-von-marin-alexe-ulrich-gosele-hrsg","provider":"Autorenwelt Shop","version":"1.0","type":"link"}