{"product_id":"three-dimensional-integration-and-modeling-von-manos-tentzeris-und-jong-hoon-lee","title":"Three-Dimensional Integration and Modeling","description":"This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity\/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF\/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. Table of Contents: Introduction \/ Background on Technologies for Millimeter-Wave Passive Front-Ends \/ Three-Dimensional Packaging in Multilayer Organic Substrates \/ Microstrip-Type Integrated Passives \/ Cavity-Type Integrated Passives \/ Three-Dimensional Antenna Architectures \/ Fully Integrated Three-Dimensional Passive Front-Ends \/ References\u003cdiv class=\"aw-variant-hidden-subtitle-div\" id=\"aw-variant-subtitle-9783031005756\"\u003e\u003ch3\u003eA Revolution in RF and Wireless Packaging\u003c\/h3\u003e\u003c\/div\u003e","brand":"Autorenwelt Shop","offers":[{"title":"Softcover - 9783031005756","offer_id":40176164405341,"sku":"9783031005756","price":35.3,"currency_code":"EUR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0940\/0622\/files\/841f2b95-f7cc-4c63-b974-06d851412704.jpg?v=1775881690","url":"https:\/\/shop.autorenwelt.de\/products\/three-dimensional-integration-and-modeling-von-manos-tentzeris-und-jong-hoon-lee","provider":"Autorenwelt Shop","version":"1.0","type":"link"}