{"product_id":"physical-design-for-multichip-modules-von-mysore-sriram-sung-mo-steve-kang","title":"Physical Design for Multichip Modules","description":"\n                                \n                \u003cem\u003ePhysical Design for Multichip Modules\u003c\/em\u003e\n                                 collects together  a large body of important research work that has been conducted in  recent years in the area of Multichip Module (MCM) design. The  material consists of a survey of published results as well as original  work by the authors. All major aspects of MCM physical design are  discussed, including interconnect analysis and modeling, system  partitioning and placement, and multilayer routing. For readers  unfamiliar with MCMs, this book presents an overview of the different  MCM technologies available today. An in-depth discussion of various  recent approaches to interconnect analysis are also presented.  Remaining chapters discuss the problems of partitioning, placement,  and multilayer routing, with an emphasis on timing performance. For  the first time, data from a wide range of sources is integrated to  present a clear picture of a new, challenging and very important  research area. For students and researchers looking for interesting  research topics, open problems and suggestions for further research  are clearly stated. \n                \n                \u003cbr\u003e\n                                  Points of interest include :\n                \n                \u003cul\u003e\n                                         \n                    \n                    \u003cli\u003e Clear overview of  MCM technology and its relationship to physical design; \u003c\/li\u003e\n                                          \n                    \n                    \u003cli\u003e  Emphasis on performance-driven design, with a chapter devoted to  recent techniques for rapid performance analysis and modeling of MCM  interconnects; \u003c\/li\u003e\n                                          \n                    \n                    \u003cli\u003e Different approaches to multilayer MCM routing  collected together and compared for the first time; \u003c\/li\u003e\n                                          \n                    \n                    \u003cli\u003e Explanation  of algorithms is not overly mathematical, yet is detailed enough to  give readers a clear understanding of the approach; \u003c\/li\u003e\n                                          \n                    \n                    \u003cli\u003e  Quantitative data provided wherever possible for comparison of  different approaches; \u003c\/li\u003e\n                                          \n                    \n                    \u003cli\u003e A comprehensive list of references to  recent literature on MCMs  provided.\u003c\/li\u003e\n                                          \n                \n                \u003c\/ul\u003e\n                            \n            \u003cdiv class=\"aw-variant-hidden-subtitle-div\" id=\"aw-variant-subtitle-9781461361534\"\u003e\u003ch3\u003e\u003c\/h3\u003e\u003c\/div\u003e\u003cdiv class=\"aw-variant-hidden-subtitle-div\" id=\"aw-variant-subtitle-9780792394501\"\u003e\u003ch3\u003e\u003c\/h3\u003e\u003c\/div\u003e","brand":"Libri","offers":[{"title":"Softcover - 9781461361534","offer_id":39415537860701,"sku":"9781461361534","price":160.49,"currency_code":"EUR","in_stock":true},{"title":"Hardcover - 9780792394501","offer_id":50726054982,"sku":"9780792394501","price":160.49,"currency_code":"EUR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0940\/0622\/files\/ee273d4b-bef9-4e04-8b3f-1e95788772f8.jpg?v=1775275985","url":"https:\/\/shop.autorenwelt.de\/products\/physical-design-for-multichip-modules-von-mysore-sriram-sung-mo-steve-kang","provider":"Autorenwelt Shop","version":"1.0","type":"link"}