{"product_id":"photonic-wire-bonding-as-a-novel-technology-for-photonic-chip-interfaces-von-nicole-lindenmann","title":"Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces","description":"To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This book contains a detailed description of the methodology of photonic wire bonding together with a number of key experiments.\u003cdiv class=\"aw-variant-hidden-subtitle-div\" id=\"aw-variant-subtitle-9783731507468\"\u003e\u003ch3\u003e\u003c\/h3\u003e\u003c\/div\u003e","brand":"Libri","offers":[{"title":"Softcover - 9783731507468","offer_id":39441207001181,"sku":"9783731507468","price":49.0,"currency_code":"EUR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0940\/0622\/files\/b3d76113-d627-4955-8056-975eaa673400.jpg?v=1780378045","url":"https:\/\/shop.autorenwelt.de\/products\/photonic-wire-bonding-as-a-novel-technology-for-photonic-chip-interfaces-von-nicole-lindenmann","provider":"Autorenwelt Shop","version":"1.0","type":"link"}