{"product_id":"interaction-of-sn-9zn-and-sn-8zn-3bi-lead-free-on-copper-metallization-von-ramani-mayappan","title":"Interaction of Sn-9Zn and Sn-8Zn-3Bi lead-free on copper metallization","description":"\u003cp\u003ePractically all microelectronic assemblies in use  today utilize Sn-Pb eutectic solder for  interconnection. Emerging environmental regulations  worldwide have targeted the elimination of Pb usage  in electronic assemblies, due to the inherent  toxicity of Pb. This has made the search for  suitable Pb-free solders an important issue for  microelectronics assembly. This book describes some  properties of Sn-9Zn and Sn-8Zn-3Bi lead-free  solders interacting with copper substrate. Some  information are given on the wetting behavior, the  interfacial reaction, mechanical properties and  growth kinetics of the solders on Cu substrate. The  wetting reaction between Sn-Zn solder and Cu  substrate is due the interaction between Zn and Cu  atoms. This interaction leads to the formation of a  flat Cu5Zn8 and scallop CuZn intermediate phases.  The book also explains the degradation of the solder  joint strength due to Zn-depletion zone and  Kirkendall voids. Finally, The evolution of the  Cu5Zn8 intermetallic and the activation energy for  the growth of the intermetallic under solid state  aging is explained in depth.\u003c\/p\u003e\u003cdiv class=\"aw-variant-hidden-subtitle-div\" id=\"aw-variant-subtitle-9783838384528\"\u003e\u003ch3\u003eWetting, joint strength and intermetallic\u003c\/h3\u003e\u003c\/div\u003e","brand":"Autorenwelt Shop","offers":[{"title":"Softcover - 9783838384528","offer_id":39469252575325,"sku":"9783838384528","price":68.0,"currency_code":"EUR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0940\/0622\/files\/764bb950-78f5-4047-bb44-b29339df36dd.jpg?v=1757656401","url":"https:\/\/shop.autorenwelt.de\/products\/interaction-of-sn-9zn-and-sn-8zn-3bi-lead-free-on-copper-metallization-von-ramani-mayappan","provider":"Autorenwelt Shop","version":"1.0","type":"link"}