{"product_id":"high-frequency-characterization-of-electronic-packaging-von-luc-martens","title":"High-Frequency Characterization of Electronic Packaging","description":"\n                                \n                \u003cem\u003eHigh-Frequency Characterization of Electronic Packaging\u003c\/em\u003e\n                                  will be of interest to researchers and designers of high-frequency  electronic packaging. Understanding high-frequency behavior of  packaging is of growing importance due to higher clock-speeds in  computers and higher data transmission rates in broadband  telecommunication systems. Basic knowledge of the high-frequency  behavior of packaging and interconnects is, therefore, indispensable  for the design of future telecommunication and computer systems. \n                \n                \u003cbr\u003e\n                                  \n                \n                \u003cem\u003eHigh-Frequency Characterization of Electronic Packaging\u003c\/em\u003e\n                                 gives  the reader an insight into how high-frequency characterization of  electronic packaging should be done and describes the problems that  have to be tackled, especially in performing accurate measurements on  modern IC-packages and in determination of circuit models. \n                \n                \u003cbr\u003e\n                                  \n                \n                \u003cem\u003eHigh-Frequency Characterization of Electronic Packaging\u003c\/em\u003e\n                                 is  conceived as a comprehensive guide for the start of research and to  help in performing high-frequency measurements. Important notions in  high- frequency characterization such as S-parameters, calibration,  probing, de-embedding and measurement-based modeling are explained.  The described techniques are illustrated with several up-to-date  examples.\n            \n            \u003cdiv class=\"aw-variant-hidden-subtitle-div\" id=\"aw-variant-subtitle-9780792383079\"\u003e\u003ch3\u003e\u003c\/h3\u003e\u003c\/div\u003e\u003cdiv class=\"aw-variant-hidden-subtitle-div\" id=\"aw-variant-subtitle-9781461375739\"\u003e\u003ch3\u003e\u003c\/h3\u003e\u003c\/div\u003e","brand":"Libri","offers":[{"title":"Hardcover - 9780792383079","offer_id":51334704198,"sku":"9780792383079","price":106.99,"currency_code":"EUR","in_stock":true},{"title":"Softcover - 9781461375739","offer_id":39415532683357,"sku":"9781461375739","price":106.99,"currency_code":"EUR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0940\/0622\/files\/7c2c18c7-badd-43e1-a195-956ae12c6aa1.jpg?v=1781324037","url":"https:\/\/shop.autorenwelt.de\/products\/high-frequency-characterization-of-electronic-packaging-von-luc-martens","provider":"Autorenwelt Shop","version":"1.0","type":"link"}