{"product_id":"3d-stacked-chips-from-emerging-processes-to-heterogeneous-systems-von-ibrahim-m-elfadel-gerhard-fettweis-hrsg","title":"3D Stacked Chips","description":"This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size.  The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.\u003cdiv class=\"aw-variant-hidden-subtitle-div\" id=\"aw-variant-subtitle-9783319793054\"\u003e\u003ch3\u003eFrom Emerging Processes to Heterogeneous Systems\u003c\/h3\u003e\u003c\/div\u003e\u003cdiv class=\"aw-variant-hidden-subtitle-div\" id=\"aw-variant-subtitle-9783319204802\"\u003e\u003ch3\u003eFrom Emerging Processes to Heterogeneous Systems\u003c\/h3\u003e\u003c\/div\u003e","brand":"Libri","offers":[{"title":"Softcover - 9783319793054","offer_id":39420490776669,"sku":"9783319793054","price":53.49,"currency_code":"EUR","in_stock":true},{"title":"Hardcover - 9783319204802","offer_id":28563554238557,"sku":"9783319204802","price":53.49,"currency_code":"EUR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0940\/0622\/files\/a442457d-44e0-4371-b128-2c593f166d9b.jpg?v=1775104752","url":"https:\/\/shop.autorenwelt.de\/products\/3d-stacked-chips-from-emerging-processes-to-heterogeneous-systems-von-ibrahim-m-elfadel-gerhard-fettweis-hrsg","provider":"Autorenwelt Shop","version":"1.0","type":"link"}