{"product_id":"rf-and-microwave-microelectronics-packaging-von-ken-kuang-franklin-kim-sean-cahill-hrsg","title":"RF and Microwave Microelectronics Packaging","description":"\n                                \n                \u003cp\u003eRF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical\/RF\/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF\/MW packaging-related fields.\u003c\/p\u003e\n                            \n            \u003cdiv class=\"aw-variant-hidden-subtitle-div\" id=\"aw-variant-subtitle-9781489983244\"\u003e\u003ch3\u003e\u003c\/h3\u003e\u003c\/div\u003e","brand":"Libri","offers":[{"title":"Softcover - 9781489983244","offer_id":39416837800029,"sku":"9781489983244","price":160.49,"currency_code":"EUR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0940\/0622\/files\/41ae3e60-d7a9-43d8-b04e-b30190b85e54.jpg?v=1778904747","url":"https:\/\/shop.autorenwelt.de\/en\/products\/rf-and-microwave-microelectronics-packaging-von-ken-kuang-franklin-kim-sean-cahill-hrsg","provider":"Autorenwelt Shop","version":"1.0","type":"link"}