{"product_id":"porous-anodic-aluminum-oxide-interposer-process-integration-fabrication-characterization-and-evaluation-von-hsiang-yu-chan","title":"Porous Anodic Aluminum Oxide Interposer","description":"\u003cp\u003ePorous anodic aluminum oxide (AAO) features its interesting nanoporous structure which is capable of being used as a template for nanopatterning, highly anisotropic nanowire fabrication, and MEMs devices fabrication. In this work, AAO was demonstrated to be an interposer substrate for 2.5\/3D packaging technology in microelectronics exploiting the unique etching characteristic of nanopores. Not only the high density vertical through via was fabricated but also metallized with Cu as void-less interconnect simply by using wet chemicals. Passive devices like inductors were embedded in AAO film after via metallization and re-distribution layer Cu electroplating which provide multi-functionalities to proposed AAO interposer. AAO with the special structural and etching properties plus its low electrical loss, thermal stability, and mechanical robustness, is a promising material for heterogeneous integration and advanced microelectronic packaging technology.\u003c\/p\u003e\u003cdiv class=\"aw-variant-hidden-subtitle-div\" id=\"aw-variant-subtitle-9786200226976\"\u003e\u003ch3\u003eProcess Integration, Fabrication, Characterization, and Evaluation\u003c\/h3\u003e\u003c\/div\u003e","brand":"Libri","offers":[{"title":"Softcover - 9786200226976","offer_id":39455260475485,"sku":"9786200226976","price":54.9,"currency_code":"EUR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0940\/0622\/files\/68851062-8c8d-4186-a607-948fe5e9641c.jpg?v=1770791881","url":"https:\/\/shop.autorenwelt.de\/en\/products\/porous-anodic-aluminum-oxide-interposer-process-integration-fabrication-characterization-and-evaluation-von-hsiang-yu-chan","provider":"Autorenwelt Shop","version":"1.0","type":"link"}